Wire saw of resin diamond 140 μm
date:2015-06-23 13:21 hits: size【
big | normal | small】
Wire saw of resin diamond is cost effective and of large scale production and high efficiency. Widely used in IC cutting, engineering ceramic and hi-tech glass.
Series No. |
Base line |
Diamond |
Application |
3 |
140um |
15-25 um |
Wafer slicing |