Product performance: raw material is MBD series diamond of high strength with special processing; crystal is regular, grit size distribution and available particle are concentrated; micro particle is of high strength; impurity content is low; dispersity and wear resistance is good.
Used for cutting, polishing and grinding of organic/inorganic brittle material, e.g. wire saw, jewelry saw, semiconductor saw etc., also used for raw/fine grinding and polishing tools of polysilicon, monocrystalline silicon, industrial/jewelry diamond, sapphire, quartz plate, LED sapphire substrate, liquid crystal glass, magnetic materials with high precision and semiconductor etc.